Electronic component processing contract

Party A: _______________

phone:_______________

fax:_______________

company address_____________

Party B: _______________

phone:_______________

fax:_______________

company address_____________

First, the original name of the processing

Quantity

Points

Delivery date

Board cleanliness

Remarks

Second, the processing content

□ Material purchasing □ Plate making □ Material check □ Leak plate

□ Wave soldering operation □ Normal temperature aging □ Insert □ Printed board cleaning

□ Finished product inspection □ Component forming, affixing protection □ Packaging □ Structural parts assembly